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| Power Transistors 2SB1193 Silicon PNP epitaxial planar type darlington Unit: mm * High forward current transfer ratio hFE * High-speed switching * Full-pack package which can be installed to the heat sink with one screw 16.70.3 Features 7.50.2 3.10.1 4.20.2 For midium-speed power switching Complementary to 2SD1773 0.70.1 10.00.2 5.50.2 4.20.2 2.70.2 Absolute Maximum Ratings TC = 25C Parameter Collector-base voltage (Emitter open) Collector-emitter voltage (Base open) Emitter-base voltage (Collector open) Collector current Peak collector current Collector power dissipation Ta = 25C Junction temperature Storage temperature Tj Tstg Symbol VCBO VCEO VEBO IC ICP PC Rating -120 -120 -7 -8 -12 50 2 150 -55 +150 C C Unit V V V A A W Solder Dip (4.0) 1.40.1 1.30.2 0.5+0.2 -0.1 14.00.5 0.80.1 2.540.3 5.080.5 123 1: Base 2: Collector 3: Emitter EIAJ: SC-67 TO-220F-A1 Package Internal Connection C B Electrical Characteristics TC = 25C 3C Parameter Collector-emitter sustaining voltage * E Conditions Min -120 -7 -100 -10 1 000 20 000 -1.5 -3.0 -2.0 -3.5 15 0.7 3.5 2.0 MHz s s s V Typ Max Unit V V A A V Symbol VCEO(SUS) IC = -2 A, L = 10 mH VEBO ICBO ICEO hFE VCE(sat)1 VCE(sat)2 VBE(sat)1 VBE(sat)2 fT ton tstg tf IE = -50 mA, IC = 0 VCB = -120 V, IE = 0 VCE = -100 V, IB = 0 VCE = -3 V, IC = -4 A IC = -4 A, IB = -8 mA IC = -8 A, IB = -80 mA IC = -4 A, IB = -8 mA IC = -8 A, IB = -80 mA VCE = -10 V, IC = - 0.5 A, f = 1 MHz IC = -4 A, IB1 = -8 mA, IB2 = 8 mA VCC = -50 V Emitter-base voltage (Collector open) Collector-base cutoff current (Emitter open) Collector-emitter cutoff current (Base open) Forward current transfer ratio Collector-emitter saturation voltage Base-emitter saturation voltage Transition frequency Turn-on time Storage time Fall time Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: VCEO(SUS) test circuit 50 Hz/60 Hz X mercury relay L 120 6V Publication date: February 2003 Y 1 15 V SJD00059AED G 1 2SB1193 PC Ta 80 (1)TC=Ta (2)With a 100x100x2mm Al heat sink (3)Without heat sink (PC=2.0W) IC VCE Collector-emitter saturation voltage VCE(sat) (V) -10 IB=-5mA -4mA -3mA VCE(sat) IC -10 TC=25C (1) IC/IB=500 (2) IC/IB=250 (3) IC/IB=100 TC=25 C (1) Collector power dissipation PC (W) -8 Collector current IC (A) 60 (1) -2mA (2) -1 (3) -6 -1.5mA -1mA -0.75mA 40 -4 - 0.1 20 (2) (3) 0 -2 -0.5mA 0 0 40 80 120 160 0 -2 -4 -6 -8 -10 -12 - 0.01 - 0.1 -1 -10 Ambient temperature Ta (C) Collector-emitter voltage VCE (V) Collector current IC (A) VBE(sat) IC -10 hFE IC TC=100C VCE=-3V ton, tstg, tf IC Turn-on time ton , Storage time tstg , Fall time tf (s) 100 Pulsed tw=1ms Duty cycle=1% IC/IB=500 (-IB1=IB2) VCC=-50V TC=25C tstg tf 104 (1)IC/IB=500 (2)IC/IB=250 (3)IC/IB=100 TC=25C Base-emitter saturation voltage VBE(sat) (V) Forward current transfer ratio hFE (2) (3) (1) 25C -25C 10 -1 103 1 ton - 0.1 102 0.1 - 0.01 - 0.1 -1 -10 10 - 0.1 -1 -10 0.01 0 -2 -4 -6 -8 Collector current IC (A) Collector current IC (A) Collector current IC (A) Safe operation area -100 Non repetitive pulse TC=25C ICP IC t=10ms t=1ms Rth t 102 (1)Without heat sink (2)With a 100x100x2mm Al heat sink (1) Thermal resistance Rth (C/W) Collector current IC (A) -10 10 (2) -1 DC 1 - 0.1 10-1 - 0.01 -1 -10 -100 -1 000 10-2 10-4 10-3 10-2 10-1 1 10 102 103 104 Collector-emitter voltage VCE (V) Time t (s) 2 SJD00059AED Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL |
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